Collaborative Research Projects

Silicon Semiconductor
 

 UV-TECH SAFC Hitech

  • Title: UV assisted technologies for multifunctional materials production
  • Partners: Tyndall Institute, UCL, LETI, Fiat, ST Microelectronics, IPM, LTM
  • Summary: The project addresses the need for integration of nanocrystal technologies with conventional processes aims to develop a photo assisted technique capable of fabrication nanocrystals in matrix structures in a highly uniform fashion. The combination of technologies opens up many new opportunities to produce novel devices and products. A range of precursors suited to the technique are required and SAFC Hitech will also study compatibility issues between material systems to ensure source stability and performance are optimised.

 REALISE

  • Title: Rare earth oxide atomic layer deposition for innovations in electronics
  • Partners: Tyndall Institute, MDM-INFM, ST Microelectronics, Qimonda, FXP, CEMES, ASM Microchemistry, Liverpool and Helsinki Uni
  • Summary: The project will address the deposition of high permittivity rare earth oxide layers with sub-nanometre control along with the integration of these films into innovative memory and communication devices. The deposition technique of choice will be ALD with liquid injection and vapour transport of precursors possible. A variety of novel precursors will be investigated and the process parameters established to achieve the desired film quality. Scale up issues will also be addressed.

 CHEMAPH

  • Title: CVD of chalcogenide materials for phase-change memories
  • Partners: CNR MDM-INFM, Aixtron, ST Microelectronics, CSIC, Vilnius Uni
  • Summary: Phase change memories (PCMs) are one of the most promising candidates for next generation non-volatile memories due to performance and scalability advantages over current flash memory. The project goal is to study a chalcogenide system and develop methodologies to fabricate PCMs. The MOCVD technique will require matched precursors to afford films with the correct properties and a wide range of sources will be studied to identify the best combination. Doping issues will also be addressed in second phase of the project. Chemical compatibility and thermal properties will be measured to further optimise processes.

 MEMSPULSE

  • Title: Wafer scale vapour phase processing for implanted healthcare
  • Partners: Point 35, Innos, Qinetiq, SMC, Semefab
  • Summary: The project will develop technologies to allow wafer scale fabrication of a range of medical application devices. Upgraded MEMS definition approaches and improved biocompatibility will be addressed aimed at the introduction of a new industrial platform suited to the mass production of such things as microfluidic diagnostic tools, sensors and actuators. Novel sources for various process stages will be investigated along with precursors for surface modification. All aspects of the fabrication process for optimum chemicals will be studied.

 DL-POP

  • Title: Direct laser point of process material synthesis using sol-gel chemistry
  • Partners: Attiger, Liverpool & Teesside Uni
  • Summary: The aim of the project is to activate Sol-gel chemistry using a laser to allow the deposition of layers and tracks fixed by the motion of the laser. The technique has great potential in a wide variety of coating areas such as wear, corrosion and hygiene as well as the capability to create "on demand" structures for sensors, actuators and other Smart functional components. A key contribution is to develop the Sol-gel chemistry to take advantage of the process potential and supply tailored solutions for a range of end uses.

 3D-DEMO

  • Title: Single step 3D deposition of complex nanopatterned multifunctional oxide thin films
  • Partners: EPFL, SAES Getters, ABCD, SCIPROM, CNRS FEMTO, NIL Rumania, ORC Southampton
  • Summary: The project will focus on thin film deposition using Laser Assisted Chemical Beam Epitaxy and new effusive source technologies. This technique allows both 3D growth and patterning in the sub micron range. The target materials are ferroelectric oxides for applications in integrated optoelectronics, optics and photonics. Novel sources and their combinations to form complex oxides will be studied to optimise performance in this new approach to layer deposition.

 MACOMUFI

  • Title: Manipulating the coupling in multiferroic films
  • Partners: Thales, Nanotec, Technoorg Linda, Crystec, CNRS CRISMAT, UMP, ICMCB and LMGP, Bonn, Liege, Groningen, Geneva, Barcelona Uni
  • Summary: The general project objective is to understand, synthesise and control novel robust multiferroic materials in thin films that exhibit a significant magnetoelectric coupling at room temperature. The knowledge and materials developed will be applied to many important electronics market segments. Novel sources for various CVD techniques will be studied to afford the desired alloy compositions to achieve improved layer properties. All aspects of the fabrication process for optimum chemicals will be studied.

 FOREMOST

  • Title: Integration of 45nm CMOS technology
  • Partners: ST Microelectronic, Philips Semiconductor, Motorola, ASM, Trikon, LETI, INPG, CNRS, Bull, Air Liquide, Qualiflow, Lamers, Jobin Yvon, Aixtron, LEICA, IMEC, Jülich, FhG Erlangen
  • Summary: The project aims to develop high level CMOS technology and critically to achieve integration on a 45nm scale. High k dielectric/metal as a gate system is to be developed using a variety of deposition techniques. Other topics covered in the project will ensure all layers and processing are optimised to allow next generation chip technology to be introduced to a 300mm production process.

 SOLFLEX

  • Title: Low temperature sol-gel deposition of novel conductors on flexible plastic substrates
  • Partners: GEM, MCE, Cadillac Plastics, TWI, Universities of Birmingham and Swansea
  • Summary: The Solflex project will develop novel enabling technologies in both coating materials and processes to deliver inorganic conductive tracks onto a range of plastics substrates, particularly for flexible displays. Sol-gel and novel printing methods will be studied at <150ºC for conventional and innovative systems.