|Related Categories||Electronic Materials, Gold Coated Substrates, Gold Surfaces and Sources, Materials Science, Micro/NanoElectronics,|
|L × W × thickness||22 mm × 22 mm × 130-170 μm, square|
|layer thickness||100 Å|
|matrix attachment||Titanium, as adhesion layer used to bind the gold to the borosilicate glass cover slip|
Corning® 0211 zinc titania glass, a particular formulation of borosilicate glass that lends itself very well to being sliced into thin pieces.
The gold surface is highly polycrystalline but shows a tendency towards <111> orientation.
Titanium adhesion layer used to bind the gold to a zinc titania glass cover slip.
Corning is a registered trademark of Corning, Inc.
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Self-assembly techniques at the supramolecular 1–100 nm scale have been extensively studied for applications ranging from biocompatible systems to microelectronics.1, 2 As the dimensions of patterned...
Thomas J. Mullen, J. Nathan Hohman, Dr. Arrelaine A. Dameron, Jennifer R. Hampton, Susan D. Gillmor, Prof. Paul S. Weiss
Material Matters 2006, 1.2, 8.
Keywords: Adsorption, Degradations, Deposition, Diffusion, Microelectronics, Microscopy, Nanotechnology, Semiconductor, Separation
Watanabe, M.O. et al. J. Vac. Sci. Technol. B 9, 924, (1990)
Aguilar, M. et al. Thin Solid Films 317, 189, (1998)
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