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643262 Aldrich

Gold coated silicon wafer

99.999% (Au), layer thickness 1000 Å, 99.99% (Ti)

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Gold coated silicon wafer 99.999% (Au), layer thickness 1000 Å, 99.99% (Ti)
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Properties

Related Categories Electronic Materials, Gold Coated Substrates, Gold Surfaces and Sources, Materials Science, Micro/NanoElectronics,
assay   99.99% (Ti)
  99.999% (Au)
diam. × thickness   4 in. × 500 μm
layer thickness   1000 Å
matrix attachment   Titanium, as adhesion layer used to bind the gold to the borosilicate glass cover slip

Description

General description

Titanium adhesion layer used to bind the gold to a silicon wafer <100>. Gold orientation is nominally highly polycrystalline with a preference to <111> orientation.1

Packaging

1 ea in padded box

Packaging 1 set in single wafer shipper

Price and Availability

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