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Product Catalog
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Metals
> Copper
Copper
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Description
Molecular Formula
Product #
Copper electrolytic, Analytical Reagent, Reag. Ph. Eur., ≥99.9% (complexometric), wire
Cu
31284
Copper bars (random sizes), 99.999+ % trace metals basis
Cu
326445
Copper beads, 2-8 mm, 99.9995% trace metals basis
Cu
254177
Copper beads, 2-8 mm, 99.99+ % trace metals basis
Cu
326488
Copper foil, thickness 1.0 mm, 99.999% trace metals basis
Cu
266744
Copper foil, thickness 0.25 mm, 99.98% trace metals basis
Cu
349178
Copper foil, thickness 0.025 mm, 99.98% trace metals basis
Cu
349208
Copper foil, ≥99.8% (complexometric)
Cu
12816
Copper granulated, ≥99.8% (complexometric)
Cu
12809
Copper platelets, thickness 6.3 mm, 99.999% trace metals basis
Cu
518905
Copper powder, 99.999% trace metals basis
Cu
203122
Copper powder, <425 μm, 99.5% trace metals basis
Cu
266086
Copper powder, <75 μm, 99%
Cu
207780
Copper powder (spheroidal), 10 μm, 99%
Cu
326453
Copper powder (dendritic), 3 μm, 99.7% trace metals basis
Cu
357456
Copper puriss., powder, ≥99.5% (complexometric)
Cu
12806
Copper rod, diam. 11 mm, 99.9999% trace metals basis
Cu
365327
Copper shot, −3-+14 mesh, 99%
Cu
223409
Copper spherical shot, −20-+30 mesh, ≥99.5% trace metals basis
Cu
520381
Copper wire, diam. 2.0 mm, 99.999% trace metals basis
Cu
349224
Copper wire, diam. 1.0 mm, 99.9+ %
Cu
349216
Copper wire, diam. 0.64 mm, 99.999% trace metals basis
Cu
326410
Copper wire, diam. 0.25 mm, 99.999% trace metals basis
Cu
326429
Copper purum p.a., turnings or granulated material, ≥99.0%
Cu
61139
Copper purum p.a., ≥99.0%, powder
Cu
61141
Copper coating quality, 99.99%, sticks
Cu
61142
Copper foil, thickness 0.5 mm, 99.98% trace metals basis
Cu
349151
Copper ACS reagent, granular, 10-40 mesh, 99.90+ %
Cu
311405
Copper powder, 99%, 1-5 μm
Cu
292583
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