Copper

Product #

Description

Molecular Formula

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31284 Copper electrolytic, Analytical Reagent, Reag. Ph. Eur., ≥99.9% (complexometric), wire Cu
326445 Copper bars (random sizes), ≥99.999% trace metals basis Cu
254177 Copper beads, 2-8 mm, 99.9995% trace metals basis Cu
326488 Copper beads, 2-8 mm, ≥99.99% trace metals basis Cu
266744 Copper foil, thickness 1.0 mm, 99.999% trace metals basis Cu
349178 Copper foil, thickness 0.25 mm, 99.98% trace metals basis Cu
349208 Copper foil, thickness 0.025 mm, 99.98% trace metals basis Cu
12816 Copper foil, ≥99.8% (complexometric) Cu
203122 Copper powder, 99.999% trace metals basis Cu
266086 Copper powder, <425 μm, 99.5% trace metals basis Cu
207780 Copper powder, <75 μm, 99% Cu
326453 Copper powder (spheroidal), 14-25 μm, 99% Cu
357456 Copper powder (dendritic), <45 μm, 99.7% trace metals basis Cu
264857 Copper rod, diam. 19 mm, 99.9998% trace metals basis Cu
365327 Copper rod, diam. 11 mm, 99.9999% trace metals basis Cu
223409 Copper shot, −3-+14 mesh, 99% Cu
520381 Copper spherical shot, −20-+30 mesh, ≥99.5% trace metals basis Cu
349224 Copper wire, diam. 2.0 mm, 99.999% trace metals basis Cu
349216 Copper wire, diam. 1.0 mm, ≥99.9% Cu
326410 Copper wire, diam. 0.64 mm, 99.995% trace metals basis Cu
326429 Copper wire, diam. 0.25 mm, 99.999% trace metals basis Cu
61139 Copper turnings, purum p.a., ≥99.0% Cu
61141 Copper purum p.a., ≥99.0%, powder Cu
349151 Copper foil, thickness 0.5 mm, 99.98% trace metals basis Cu
311405 Copper ACS reagent, granular, 10-40 mesh, ≥99.90% Cu
767476 Copper sputtering target, diam. × thickness 2.00 in. × 0.25 in., 99.95% trace metals basis Cu