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Product Catalog >  Materials Science >  Micro/NanoElectronics >  Vapor Deposition Precursors >  Precursors Packaged for Deposition Systems

Precursors Packaged for Deposition Systems



Modifying materials by coating them with nano-scale ceramic or hybrid layers is a versatile way to add new value, advanced features and unique properties to otherwise conventional materials.1 Creating nano-films on a material’s surface can significantly improve or even completely change its optical, electrical and electronic properties as well as introduce new unique properties such as exceptional hardness or corrosion resistance.2,3

Frequently, the technique of choice for the modification of various surfaces is Atomic Layer Deposition (ALD), which uses consecutive chemical reactions on the material’s surface to create nano-layer or three-dimensional nano-structures.1 Aldrich Materials Science offers high-quality precursors for Atomic Layer Deposition (ALD) packaged in steel cylinders suitable for deposition systems.

We will continue to expand our portfolio of ALD precursors to include new materials. The most recent list of our products is shown in the table below. For additional vapor deposition precursors prepackaged in cylinders, please contact us by email at matsci@sial.com.

References
1. Material Matters, 2008, v.3, No.2
2. Material Matters, 2006, v.1, No.3
3. ChemFiles, 2004, v.4 No.3

Description
Molecular Formula
Form
Product #
Add to Cart
Bis(tert-butylimino)bis(dimethylamino)tungsten(VI) packaged for use in deposition systems ((CH3)3CN)2W(N(CH3)2)2 liquid
668885pricing
Tris(tert-butoxy)silanol packaged for use in deposition systems, 99.999% trace metals basis ((CH3)3CO)3SiOH solid
697281pricing
Diethylzinc packaged for use in deposition systems (C2H5)2Zn liquid
668729pricing
Trimethylaluminum packaged for use in deposition systems (CH3)3Al liquid
663301pricing
Tris(diethylamido)(tert-butylimido)tantalum(V) packaged for use in deposition systems (CH3)3CNTa(N(C2H5)2)3 liquid
668990pricing
Tris(tert-pentoxy)silanol packaged for use in deposition systems, ≥99.99% trace metals basis (CH3CH2C(CH3)2O)3SiOH liquid
697303pricing
Trimethyl(methylcyclopentadienyl)platinum(IV) packaged for use in deposition systems New C5H4CH3Pt(CH3)3 low-melting solid
697540pricing
Bis(ethylcyclopentadienyl)ruthenium(II) packaged for use in deposition systems C7H9RuC7H9 liquid
679798pricing
(3-Aminopropyl)triethoxysilane packaged for use in deposition systems, 99% New H2N(CH2)3Si(OC2H5)3 706493pricing
Water packaged for use in deposition systems New H2O 697125pricing
Silicon tetrachloride packaged for use in deposition systems SiCl4 liquid
688509pricing
Titanium tetrachloride packaged for use in deposition systems, ≥99.995% trace metals basis TiCl4 liquid
697079pricing
Titanium(IV) isopropoxide packaged for use in deposition systems Ti[OCH(CH3)2]4 liquid
687502pricing
Tetrakis(dimethylamido)hafnium(IV) packaged for use in deposition systems, ≥99.99% trace metals basis [(CH3)2N]4Hf low-melting solid
666610pricing
Tetrakis(dimethylamido)titanium(IV) packaged for use in deposition systems, 99.999% trace metals basis [(CH3)2N]4Ti liquid
669008pricing
Tetrakis(dimethylamido)zirconium(IV) packaged for use in deposition systems [(CH3)2N]4Zr solid
669016pricing
Tris[N,N-bis(trimethylsilyl)amide]yttrium packaged for use in deposition systems [[(CH3)3Si]2N]3Y 702021pricing
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