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349178

Sigma-Aldrich

Copper

foil, thickness 0.25 mm, 99.98% trace metals basis

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Sinônimo(s):
Copper sheet
Fórmula empírica (Notação de Hill):
Cu
Número CAS:
Peso molecular:
63.55
Número CE:
Número MDL:
Código UNSPSC:
11101604
ID de substância PubChem:
NACRES:
NA.23

Nível de qualidade

Ensaio

99.98% trace metals basis

forma

foil

resistividade

1.673 μΩ-cm, 20°C

espessura

0.25 mm

pb

2567 °C (lit.)

pf

1083.4 °C (lit.)

densidade

8.94 g/mL at 25 °C (lit.)

aplicação(ões)

battery manufacturing

cadeia de caracteres SMILES

[Cu]

InChI

1S/Cu

chave InChI

RYGMFSIKBFXOCR-UHFFFAOYSA-N

Descrição geral

Copper foil with a thickness of 0.25 mm and a 99.98% trace metals basis is a top-quality product that has numerous industrial and commercial applications. It is produced using cutting-edge manufacturing processes that ensure superior quality and consistency. The foil is carefully inspected to meet the specified purity level and is free from any imperfections like scratches, dents, and tears. Copper foil is a highly versatile material that offers outstanding electrical conductivity, thermal conductivity, and corrosion resistance.

Aplicação

Copper foil is commonly used in a variety of applications such as printed circuit boards (PCBs), electromagnetic shielding, and as a substrate in chemical vapor deposition. The 0.25 mm thickness of this foil makes it suitable for many applications, providing sufficient strength and durability while remaining easy to handle and manipulate. The 99.98% trace metals basis ensures that the copper foil is of the highest quality, with only minimal levels of impurities like lead, arsenic, and bismuth. This level of purity is critical for many industrial applications, particularly those in the electronics industry, where even small amounts of impurities can significantly impact the performance and reliability of the end product.

Quantidade

50×50 mm (approximately 5.5 g)
150×150 mm (approximately 49.5 g)

Classe de risco de água (WGK)

WGK 2

Ponto de fulgor (°F)

Not applicable

Ponto de fulgor (°C)

Not applicable

Equipamento de proteção individual

Eyeshields, Gloves, type N95 (US)


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Stephen G Kaler et al.
The New England journal of medicine, 358(6), 605-614 (2008-02-08)
Menkes disease is a fatal neurodegenerative disorder of infancy caused by diverse mutations in a copper-transport gene, ATP7A. Early treatment with copper injections may prevent death and illness, but presymptomatic detection is hindered by the inadequate sensitivity and specificity of
Daniel L Priebbenow et al.
Organic letters, 15(24), 6155-6157 (2013-11-28)
A method has been developed for the preparation of N-alkynylated sulfoximines involving the copper-catalyzed decarboxylative coupling of sulfoximines with aryl propiolic acids. A range of substituents on both the sulfoximidoyl moiety and the aryl group of the propiolic acid were
Hiroshi Sato et al.
Science (New York, N.Y.), 343(6167), 167-170 (2013-12-18)
Carbon monoxide (CO) produced in many large-scale industrial oxidation processes is difficult to separate from nitrogen (N2), and afterward, CO is further oxidized to carbon dioxide. Here, we report a soft nanoporous crystalline material that selectively adsorbs CO with adaptable
Magnus Andersson et al.
Nature structural & molecular biology, 21(1), 43-48 (2013-12-10)
Heavy metals in cells are typically regulated by PIB-type ATPases. The first structure of the class, a Cu(+)-ATPase from Legionella pneumophila (LpCopA), outlined a copper transport pathway across the membrane, which was inferred to be occluded. Here we show by
Yan Meng et al.
Biochimica et biophysica acta, 1690(3), 208-219 (2004-10-30)
Hepatic abnormalities in Long-Evans Cinnamon (LEC) rats, an animal model of Wilson disease (WD), were restored by the expression of the human ATP7B cDNA under the control of CAG promoter. Expression of ATP7B transcript and protein in the liver of

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