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sputtering target, diam. × thickness 3.00 in. × 0.125 in., 99.995% trace metals basis

Empirical Formula (Hill Notation):
Número CAS:
Peso molecular:
Número EC:
Número MDL:
ID de substância PubChem:


99.995% trace metals basis



temperatura de autoignição

860 °F

reaction suitability

core: titanium


42.0 μΩ-cm, 20°C

diâmetro × espessura

3.00 in. × 0.125 in.


3287 °C (lit.)


1660 °C (lit.)


4.5 g/mL at 25 °C (lit.)

SMILES string




InChI key



1 ea in rigid mailer


Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. It is commonly used for thin-film deposition, etching and analytical techniques.

Código de classe de armazenamento

13 - Non Combustible Solids



Ponto de fulgor (ºF)

Not applicable

Ponto de fulgor (ºC)

Not applicable

Certificado de análise

Certificado de origem

Sigmund, P.
Physical Review, 184, 383-383 (1969)
Dahn, J. R.; Trussler, S.; Hatchard, T. D.; Bonakdarpour, B. et al.
Chemistry of Materials, 14, 3519-3519 (2002)
Hahn, H.; Averback, R. S.
Journal of Applied Physics, 67, 1113-1113 (1990)
Oechsner, H.
Applied Physics. A, Materials Science & Processing, 8, 185-185 (1975)
A Kurbad et al.
International journal of computerized dentistry, 16(2), 125-141 (2013-08-13)
This article presents two novel options for lithium-disilicate restorations supported by single-tooth implants. By using a Ti-Base connector, hybrid abutments and hybrid abutment crowns can be fabricated for different implant systems. The latter option in particular is an interesting new


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