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Nickel, wire, diam. 0.5 mm, ≥99.9% trace metals basis
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Nickel, foil, thickness 0.1 mm, 99.98% trace metals basis
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Nickel, foil, thickness 0.5 mm, 99.98% trace metals basis
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Nickel, rod, diam. 6.35 mm, ≥99.99% trace metals basis
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Nickel, powder, <50 μm, 99.7% trace metals basis
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Nickel, nanopowder, <100 nm avg. part. size, ≥99% trace metals basis
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Nickel, powder, <150 μm, 99.99% trace metals basis
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Nickel, foil, thickness 0.25 mm, 99.995% trace metals basis
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Nickel, wire, diam. 0.5 mm, ≥99.99% trace metals basis
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Nickel, powder, <1 μm, 99.8% trace metals basis
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Nickel, foil, thickness 0.125 mm, ≥99.9%
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Silicon, pieces, 99.95% trace metals basis
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Nickel, wire, diam. 0.25 mm, ≥99.9%
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Silicon, powder, −325 mesh, 99% trace metals basis
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Silicon, powder, −60 mesh, 99.998% trace metals basis
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Raney®-Nickel, W.R. Grace and Co. Raney® 2400, slurry, in H2O, active catalyst
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Raney®-Nickel, W.R. Grace and Co. Raney® 2800, slurry, in H2O, active catalyst
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Silicon, wafer (single side polished), <111>, N-type, contains no dopant, diam. × thickness 2 in. × 0.5 mm
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Silicon, wafer (single side polished), <100>, N-type, contains no dopant, diam. × thickness 2 in. × 0.5 mm
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Silicon, wafer, <111>, P-type, contains boron as dopant, diam. × thickness 2 in. × 0.3 mm
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Silicon, wafer (single side polished), <100>, N-type, contains no dopant, diam. × thickness 3 in. × 0.5 mm
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Silicon, nanopowder, <100 nm particle size (TEM), ≥98% trace metals basis
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Silicon, sputtering target, diam. × thickness 2.00 in. × 0.25 in., 99.999% trace metals basis
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Nickel, sputtering target, diam. × thickness 2.00 in. × 0.25 in., 99.95% trace metals basis
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Silicon, wafer (single side polished), <100>, N-type, contains phosphorus as dopant, diam. × thickness 2 in. × 0.5 mm
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Silicon, wafer (single side polished), contains phosphorus as dopant, <111>, N-type, diam. × thickness 2 in. × 0.5 mm
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Silicon, wafer (single side polished), <100>, P-type, contains boron as dopant, diam. × thickness 2 in. × 0.5 mm
Sigma-Aldrich
Silicon, wafer (single side polished), <111>, P-type, contains boron as dopant, diam. × thickness 3 in. × 0.5 mm
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Silicon, wafer (single side polished), <111>, N-type, contains no dopant, diam. × thickness 3 in. × 0.5 mm
Sigma-Aldrich
Silicon, wafer (single side polished), <100>, P-type, contains boron as dopant, diam. × thickness 3 in. × 0.5 mm