mfcd00011264

foil, thickness 0.127 mm, 99.7% trace metals basis

foil, thickness 0.25 mm, 99.7% trace metals basis

powder, −100 mesh, 99.7% trace metals basis

powder, <45 μm avg. part. size, 99.98% trace metals basis

fine powder 95%

≤10 mm, ≥99.99% trace metals basis (purity exclusive of Na and K content)

sponge, 1-20 mm, 99.5% trace metals basis

wire, diam. 0.25 mm, 99.7% trace metals basis

foil, thickness 0.025 mm, 99.98% trace metals basis

evaporation slug, diam. × L 6.3 mm × 6.3 mm, ≥99.99% trace metals basis

foil, thickness 0.25 mm, 99.99% trace metals basis

wire, diam. 1.0 mm, 99.99% trace metals basis

foil, thickness 2.0 mm, 99.7% trace metals basis

foil, thickness 0.127 mm, ≥99.99% trace metals basis

foil, thickness 0.5 mm, 99.99% trace metals basis

wire, diam. 0.5 mm, 99.99% trace metals basis

powder, max. particle size 75 micron, weight 200 g, purity 99.5%

powder, 75 max. part. size (micron), weight 50 g, purity 99.5%

tube, 1000mm, outside diameter 10.3mm, inside diameter 8.7mm, wall thickness 0.8mm, annealed, 99.6+%

sputtering target, diam. × thickness 2.00 in. × 0.25 in., 99.995% trace metals basis

foil, thickness 0.02 mm, length 2 m, purity 99.6+%

powder, max. particle size 150 micron, weight 50 g, purity 99.5%

foil, thickness 0.001 mm, size 50 × 50 mm, high purity 99.99+%

foil, thickness 0.01 mm, size 50 × 50 mm, high purity 99.99+%

powder, max. particle size 150 micron, weight 200 g, purity 99.5%

powder, max. particle size 75 micron, weight 500 g, purity 99.5%

powder, max. particle size 150 micron, weight 100 g, purity 99.5%

foil, thickness 0.025 mm, size 150 × 150 mm, purity 99.6+%

foil, thickness 0.075 mm, size 100 × 100 mm, purity 99.6+%

wire, diam. 0.81 mm, 99.7% trace metals basis