749044

Sigma-Aldrich

sputtering target, diam. × thickness 3.00 in. × 0.125 in., 99.995% trace metals basis

Empirical Formula (Hill Notation):
Ti
CAS号:
分子量:
47.87
EC 号:
MDL编号:
PubChem化学物质编号:

测定

99.995% trace metals basis

形式

solid

自燃温度

860 °F

reaction suitability

core: titanium

电阻率

42.0 μΩ-cm, 20°C

直径× 厚度

3.00 in. × 0.125 in.

bp

3287 °C (lit.)

mp

1660 °C (lit.)

密度

4.5 g/mL at 25 °C (lit.)

SMILES string

[Ti]

InChI

1S/Ti

InChI key

RTAQQCXQSZGOHL-UHFFFAOYSA-N

包装

1 ea in rigid mailer

应用

Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. It is commonly used for thin-film deposition, etching and analytical techniques.

RIDADR

NONH for all modes of transport

WGK Germany

nwg

闪点(F)

Not applicable

闪点(C)

Not applicable

分析证书

原产地证书 (CofO)

Dahn, J. R.; Trussler, S.; Hatchard, T. D.; Bonakdarpour, B. et al.
Chemistry of Materials, 14, 3519-3519 (2002)
Hahn, H.; Averback, R. S.
Journal of Applied Physics, 67, 1113-1113 (1990)
Sigmund, P.
Physical Review, 184, 383-383 (1969)
Oechsner, H.
Applied Physics. A, Materials Science & Processing, 8, 185-185 (1975)
A Kurbad et al.
International journal of computerized dentistry, 16(2), 125-141 (2013-08-13)
This article presents two novel options for lithium-disilicate restorations supported by single-tooth implants. By using a Ti-Base connector, hybrid abutments and hybrid abutment crowns can be fabricated for different implant systems. The latter option in particular is an interesting new...
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