1.02700

Copper

foil about 0.1 mm thickness for analysis EMSURE^®

• 别名: Copper
• 经验公式（希尔记法）: Cu
• CAS号: 7440-50-8
• 分子量: 63.55
• MDL號碼: MFCD00010965
• 分類程式碼代碼: 12141711
• 酶委員會索引編號: 231-159-6
• NACRES: NA.21

属性

• 品質等級: 300
• 產品線: EMSURE^®
• 化驗: ≥99.7% (iodometric)
• 形狀: solid
• 雜質: ≤0.02% Substances insoluble in nitric acid
• bp: 2580 °C/1013 hPa
• mp: 1083 °C
• 密度: 8.96 g/cm³
• 體積密度: 1000 kg/m³
• 正離子痕跡: Ag: ≤0.002%; As: ≤0.0002%; Fe: ≤0.005%; Mn: ≤0.005%; Pb: ≤0.05%; Sb: ≤0.005%; Sn: ≤0.005%
• 儲存溫度: 2-30°C
• InChI: 1S/Cu
• InChI 密鑰: RYGMFSIKBFXOCR-UHFFFAOYSA-N

说明

應用

• Electron-electron scattering limits thermal conductivity of metals under extremely high electron temperatures: The study discusses how copper′s thermal properties are influenced under extreme conditions, applicable in high-performance electronics (Karna and Giri, 2024).


• Lateral Flow Assay Biotesting by Utilizing Plasmonic Nanoparticles Made of Inexpensive Metals: Demonstrates copper′s potential as a cost-effective alternative to gold in diagnostic assays, broadening access to healthcare technologies (Bahamondes Lorca et al., 2024).

分析報告

Assay (iodometric): ≥ 99.7 %
Substances insoluble in nitric acid: ≤ 0.02 %
Ag (Silver): ≤ 0.002 %
As (Arsenic): ≤ 0.0002 %
Fe (Iron): ≤ 0.005 %
Mn (Manganese): ≤ 0.005 %
Pb (Lead): ≤ 0.05 %
Sb (Antimony): ≤ 0.005 %
Sn (Tin): ≤ 0.005 %

法律資訊

EMSURE is a registered trademark of Merck KGaA, Darmstadt, Germany

安全信息

• 儲存類別代碼: 13 - Non Combustible Solids
• 水污染物質分類（WGK）: WGK 2
• 閃點（°F）: Not applicable
• 閃點（°C）: Not applicable