Atomic Layer Deposition (ALD) is a coating technology that allows perfectly conformal deposition onto complex 3D surfaces. The reason for this uniform coating lies in the saturative chemisorption of sequential cycles of precursor vapors.
Some of the most innovative uses for atomic layer deposition (ALD) include synthesis of novel structures, area-selective deposition of materials, low-temperature ALD deposition, and temperature-sensitive subtrates.
Copper metal deposition processes are an essential tool for depositing interconnects used in microelectronic applications, giving group 11 (coinage metals: Copper, Silver, and Gold) an important place in atomic layer deposition (ALD) process development.
The production of hydrogen by catalytic water splitting is important for a wide range of industries including renewable energy petroleum refining and for the production of methanol and ammonia in the chemical industry.
The conductivity of organic semiconductors can be increased, and the barriers to charge-carrier injection from other materials can be reduced, by the use of highly reducing or oxidizing species to n- or p-dope, respectively, the semiconductor.
Spin-based electronic (spintronic) devices offer significant improvement to the limits of conventional charge-based memory and logic devices which suffer from high power usage, leakage current, performance saturation, and device complexity.