mfcd00011264

foil, thickness 0.127 mm, 99.7% trace metals basis

foil, thickness 0.25 mm, 99.7% trace metals basis

powder, <45 μm avg. part. size, 99.98% trace metals basis

powder, −100 mesh, 99.7% trace metals basis

mesh, 100x100mm, nominal aperture 0.19mm, wire diameter 0.23mm, 60x60 wires/inch, open area 20%, twill weave

wire, diam. 0.25 mm, 99.7% trace metals basis

sponge, 1-20 mm, 99.5% trace metals basis

sputtering target, diam. × thickness 2.00 in. × 0.25 in., 99.995% trace metals basis

mesh, 100x100mm, nominal aperture 4.3mm, wire diameter 1.5mm, 4.4x4.4 wires/inch, open area 94%, platinized diamond mesh

sheet, thickness 5.0 mm, size 20 × 20 mm, tolerance 0.2

foil, thickness 0.025 mm, 99.98% trace metals basis

≤10 mm, ≥99.99% trace metals basis (purity exclusive of Na and K content)

foil, thickness 0.25 mm, 99.99% trace metals basis

foil, thickness 0.5 mm, 99.99% trace metals basis

foil, thickness 2.0 mm, 99.7% trace metals basis

foil, thickness 0.127 mm, ≥99.99% trace metals basis

powder, 150 max. part. size (micron), weight 1000 g, purity 99.5%

powder, max. particle size 75 micron, weight 200 g, purity 99.5%

foil, thickness 0.05 mm, size 150 × 150 mm, purity 99.6+%

powder, max. particle size 150 micron, weight 100 g, purity 99.5%

foil, thickness 0.075 mm, size 100 × 100 mm, purity 99.6+%

evaporation slug, diam. × L 6.3 mm × 6.3 mm, ≥99.99% trace metals basis

wire, diam. 0.81 mm, 99.7% trace metals basis

foil, thickness 0.02 mm, length 1 m, purity 99.6+%

rod, 10mm, diameter 50mm, 99.99+%

wire, diam. 1.0 mm, 99.99% trace metals basis

rod, 25mm, diameter 50mm, 99.99+%

wire, diam. 0.5 mm, 99.99% trace metals basis

powder, 150 max. part. size (micron), weight 500 g, purity 99.5%

powder, max. particle size 75 micron, weight 500 g, purity 99.5%