Flexible Lamination Encapsulation.

Advanced materials (Deerfield Beach, Fla.) (2015-06-24)
Min-Ho Park, Jin-You Kim, Tae-Hee Han, Tae-Sik Kim, Hobeom Kim, Tae-Woo Lee
要旨

A novel flexible encapsulation method (Flex Lami-capsulation) is reported, which can be applied in the roll-to-roll process for mass production of organic electronic devices. Flex Lami-capsulation is very simple, fast, and getter-free, and is as effective as glass encapsulation. Use of this method is feasible in large-area flexible displays and does not have the drawbacks of conventional encapsulation methods.

材料
製品番号
ブランド
製品内容

Sigma-Aldrich
Nafion 117含有 溶液, ~5% in a mixture of lower aliphatic alcohols and water
Sigma-Aldrich
ナフィオンを含む過フッ素化樹脂溶液1100W, 5 wt. % in lower aliphatic alcohols and water, contains 15-20% water
Sigma-Aldrich
Nafion分散 溶液, 5 wt. % in mixture of lower aliphatic alcohols and water, contains 45% water
Sigma-Aldrich
Nafion膜, Nafion 117, thickness 0.007 in.
Sigma-Aldrich
Nafion分散 溶液, 5 wt. % in mixture of lower aliphatic alcohols and water, contains 45% water
Sigma-Aldrich
Nafion膜, thickness 0.002 in.
Sigma-Aldrich
Nafion NR50
Sigma-Aldrich
D.E.R. 332, used as embedding medium
Sigma-Aldrich
タンタル(V)エトキシド, 99.98% trace metals basis
Sigma-Aldrich
ナフィオン117製ペルフルオロ膜, thickness 0.007 in.
Sigma-Aldrich
Nafion分散 溶液, 20 wt. % in lower aliphatic alcohols and water, contains 34% water
Sigma-Aldrich
Nafion分散溶液, 10 wt. % in H2O, eq. wt. 1,100
Sigma-Aldrich
Nafion膜, Nafion 115, thickness 0.005 in.
Sigma-Aldrich
Nafion膜, Nafion 117, thickness 0.007 in., sheet size 7.5 cm × 13.0 cm
Sigma-Aldrich
ナフィオンを原料とする全フッ素置換樹脂(粉末)
Sigma-Aldrich
Nafion分散 溶液, 20 wt. % in mixture of lower aliphatic alcohols and water, contains 34% water
Sigma-Aldrich
Nafion膜, Nafion 424, reinforced with poly(tetrafluoroethylene) fiber, thickness 0.013 in.
Sigma-Aldrich
Nafion膜, Nafion 324, reinforced with poly(tetrafluoroethylene) fiber, thickness 0.006 in.
Sigma-Aldrich
Nafion膜, Nafion 117, thickness × L × W 0.007 in. × 0.61 m × 2.5 m, sheet
タンタル(V)エトキシド, packaged for use in deposition systems