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349178

Sigma-Aldrich

Copper

foil, thickness 0.25 mm, 99.98% trace metals basis

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Sinónimos:
Copper sheet
Empirical Formula (Hill Notation):
Cu
Número de CAS:
7440-50-8
Peso molecular:
63.55
Número de EC:
231-159-6
Número MDL:
MFCD00010965
ID de la sustancia en PubChem:
24861498
NACRES:
NA.23

Nivel de calidad

100

Análisis

99.98% trace metals basis

formulario

foil

resistividad

1.673 μΩ-cm, 20°C

grosor

0.25 mm

bp

2567 °C (lit.)

mp

1083.4 °C (lit.)

densidad

8.94 g/mL at 25 °C (lit.)

application(s)

battery manufacturing

SMILES string

[Cu]

InChI

1S/Cu

InChI key

RYGMFSIKBFXOCR-UHFFFAOYSA-N

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Este artículo
266744GF02509185GF01344518
Copper foil, thickness 0.25 mm, 99.98% trace metals basis

Sigma-Aldrich

349178

Copper

Copper foil, thickness 1.0 mm, 99.999% trace metals basis

Sigma-Aldrich

266744

Copper

Copper microfoil, disks, 10mm, thinness 1.0μm, specific density 899μg/cm2, permanent mylar 3.5μm support, 99.99+%

GF02509185

Copper

Copper - O.F.H.C. foil, 50mm disks, thickness 0.7mm, half hard, 99.95+%

GF01344518

Copper - O.F.H.C.

form

foil

form

foil

form

foil

form

foil

resistivity

1.673 μΩ-cm, 20°C

resistivity

1.673 μΩ-cm, 20°C

resistivity

1.673 μΩ-cm, 20°C

resistivity

1.673 μΩ-cm, 20°C

bp

2567 °C (lit.)

bp

2567 °C (lit.)

bp

2567 °C (lit.)

bp

2567 °C (lit.)

mp

1083.4 °C (lit.)

mp

1083.4 °C (lit.)

mp

1083.4 °C (lit.)

mp

1083.4 °C (lit.)

density

8.94 g/mL at 25 °C (lit.)

density

8.94 g/mL at 25 °C (lit.)

density

8.94 g/mL at 25 °C (lit.)

density

8.94 g/mL at 25 °C (lit.)

Descripción general

Copper foil with a thickness of 0.25 mm and a 99.98% trace metals basis is a top-quality product that has numerous industrial and commercial applications. It is produced using cutting-edge manufacturing processes that ensure superior quality and consistency. The foil is carefully inspected to meet the specified purity level and is free from any imperfections like scratches, dents, and tears. Copper foil is a highly versatile material that offers outstanding electrical conductivity, thermal conductivity, and corrosion resistance.

Aplicación

Copper foil is commonly used in a variety of applications such as printed circuit boards (PCBs), electromagnetic shielding, and as a substrate in chemical vapor deposition. The 0.25 mm thickness of this foil makes it suitable for many applications, providing sufficient strength and durability while remaining easy to handle and manipulate. The 99.98% trace metals basis ensures that the copper foil is of the highest quality, with only minimal levels of impurities like lead, arsenic, and bismuth. This level of purity is critical for many industrial applications, particularly those in the electronics industry, where even small amounts of impurities can significantly impact the performance and reliability of the end product.

Cantidad

50×50 mm (approximately 5.5 g)
150×150 mm (approximately 49.5 g)

Código de clase de almacenamiento

13 - Non Combustible Solids

WGK

WGK 2

Punto de inflamabilidad F

Not applicable

Punto de inflamabilidad C

Not applicable

Equipo de protección personal

Eyeshields, Gloves, type N95 (US)

Certificates of Analysis (COA)

Search for Certificates of Analysis (COA) by entering the products Lot/Batch Number. Lot and Batch Numbers can be found on a product’s label following the words ‘Lot’ or ‘Batch’.

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Las referencias de los producto se combinan con los tamaños de envase y las cantidades cuando se muestran en la página web, por ejemplo: T1503-25G. Asegúrese de introducir el número de producto ÚNICAMENTE en el campo del Número de producto (Ejemplo T1503).

Ejemplo

T1503
Referencia del producto
-
25G
Tamaño del envase/cantidad

Otros ejemplos

705578-5MG-PW

PL860-CGA/SHF-1EA

MMYOMAG-74K-13

1000309185

introducir como1.000309185)

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Lot and Batch Numbers can be found on a product's label following the words 'Lot' or 'Batch'.

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  • Si encuentra un número de lote como TO09019TO, introduzca el número de lote 09019TO sin las dos primeras letras.

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Copper foil, thickness 0.1 mm, 8 mm diameter, high purity 99.99+%

GF00129350

Copper

Copper - O.F.H.C. foil, 100x100mm, thickness 0.125mm, hard, 99.95+%

GF46869777

Copper - O.F.H.C.

Copper foil, thickness 0.022 mm, length 20 m, coil width 0.45 mm

GF00653813

Copper

Copper foil, thickness 1.0 mm, 25 mm diameter, high purity 99.99+%

GF00907905

Copper

Copper foil, thickness 0.125 mm, size 100 × 100 mm, purity 99.9%

GF60632759

Copper

Hiroshi Sato et al.
Science (New York, N.Y.), 343(6167), 167-170 (2013-12-18)
Carbon monoxide (CO) produced in many large-scale industrial oxidation processes is difficult to separate from nitrogen (N2), and afterward, CO is further oxidized to carbon dioxide. Here, we report a soft nanoporous crystalline material that selectively adsorbs CO with adaptable
Magnus Andersson et al.
Nature structural & molecular biology, 21(1), 43-48 (2013-12-10)
Heavy metals in cells are typically regulated by PIB-type ATPases. The first structure of the class, a Cu(+)-ATPase from Legionella pneumophila (LpCopA), outlined a copper transport pathway across the membrane, which was inferred to be occluded. Here we show by
Yan Meng et al.
Biochimica et biophysica acta, 1690(3), 208-219 (2004-10-30)
Hepatic abnormalities in Long-Evans Cinnamon (LEC) rats, an animal model of Wilson disease (WD), were restored by the expression of the human ATP7B cDNA under the control of CAG promoter. Expression of ATP7B transcript and protein in the liver of
Seiko Ishida et al.
Proceedings of the National Academy of Sciences of the United States of America, 110(48), 19507-19512 (2013-11-13)
Copper is an essential trace element, the imbalances of which are associated with various pathological conditions, including cancer, albeit via largely undefined molecular and cellular mechanisms. Here we provide evidence that levels of bioavailable copper modulate tumor growth. Chronic exposure
R Squitti et al.
Neurology, 67(1), 76-82 (2006-07-13)
To assess whether serum copper in Alzheimer disease (AD) correlates with cognitive scores, beta-amyloid, and other CSF markers of neurodegeneration. The authors studied copper, ceruloplasmin, total peroxide, and antioxidants levels (TRAP) in serum; beta-amyloid in plasma; and copper, beta-amyloid, h-tau
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