Copper foil with a thickness of 0.25 mm and a 99.98% trace metals basis is a top-quality product that has numerous industrial and commercial applications. It is produced using cutting-edge manufacturing processes that ensure superior quality and consistency. The foil is carefully inspected to meet the specified purity level and is free from any imperfections like scratches, dents, and tears. Copper foil is a highly versatile material that offers outstanding electrical conductivity, thermal conductivity, and corrosion resistance.
Copper foil is commonly used in a variety of applications such as printed circuit boards (PCBs), electromagnetic shielding, and as a substrate in chemical vapor deposition. The 0.25 mm thickness of this foil makes it suitable for many applications, providing sufficient strength and durability while remaining easy to handle and manipulate. The 99.98% trace metals basis ensures that the copper foil is of the highest quality, with only minimal levels of impurities like lead, arsenic, and bismuth. This level of purity is critical for many industrial applications, particularly those in the electronics industry, where even small amounts of impurities can significantly impact the performance and reliability of the end product.
25, 225 cm2
5.5, 49.5 g in rigid mailer
50×50 mm (approximately 5.5 g)
150×150 mm (approximately 49.5 g)