Three different conditions of surface activation bonding, 0.5 m/min, 1.0 m/min and 1.5 m/min surface activation treatment speed, on copper and nickel substrate were investigated from the view point of adhesion of Cu-Ni clad metal. The specimen treated with surface activation treatment speed 1.0 m/min (Sample B) had higher peel strength properties than 0.5 m/min (Sample A) which has more long plasma treatment time. Observing the interface of clad with TEM and XPS spectra, sample B has relatively thin oxide interface including Cu2O and sample A has thick oxide interface including CuO. From these result, it is suggested that the better adhesion of Cu-Ni clad on the SAB process is not due to the increase of plasma treatment exposure time but due more to the control of forming condition as much as thin Cu2O layer growing epitaxial form.
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