Merck

349178

Sigma-Aldrich

foil, thickness 0.25 mm, 99.98% trace metals basis

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别名:
Copper sheet
Empirical Formula (Hill Notation):
Cu
CAS号:
分子量:
63.55
EC 号:
MDL编号:
PubChem化学物质编号:
NACRES:
NA.23

质量水平

检测方案

99.98% trace metals basis

形式

foil

电阻率

1.673 μΩ-cm, 20°C

厚度

0.25 mm

bp

2567 °C (lit.)

mp

1083.4 °C (lit.)

密度

8.94 g/mL at 25 °C (lit.)

application(s)

battery manufacturing

SMILES string

[Cu]

InChI

1S/Cu

InChI key

RYGMFSIKBFXOCR-UHFFFAOYSA-N

相关类别

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此商品
266744GF73997386GF13807188
Copper foil, thickness 0.25 mm, 99.98% trace metals basis

Sigma-Aldrich

349178

Copper foil, thickness 1.0 mm, 99.999% trace metals basis

Sigma-Aldrich

266744

Copper microfoil, disks, 10mm, thinness 0.5μm, specific density 448μg/cm2, permanent mylar 3.5μm support, 99.99+%

GF73997386

Copper microfoil, disks, 10mm, thinness 0.1μm, specific density 86.2μg/cm2, permanent mylar 3.5μm support, 99.99+%

GF13807188

form

foil

form

foil

form

foil

form

foil

resistivity

1.673 μΩ-cm, 20°C

resistivity

1.673 μΩ-cm, 20°C

resistivity

1.673 μΩ-cm, 20°C

resistivity

1.673 μΩ-cm, 20°C

bp

2567 °C (lit.)

bp

2567 °C (lit.)

bp

2567 °C (lit.)

bp

2567 °C (lit.)

mp

1083.4 °C (lit.)

mp

1083.4 °C (lit.)

mp

1083.4 °C (lit.)

mp

1083.4 °C (lit.)

density

8.94 g/mL at 25 °C (lit.)

density

8.94 g/mL at 25 °C (lit.)

density

8.94 g/mL at 25 °C (lit.)

density

8.94 g/mL at 25 °C (lit.)

一般描述

铜箔厚度为 0.25 毫米,含有 99.98% 的微量金属,是一种高质量的产品,具有众多的工业和商业应用。它采用尖端的制造工艺生产,确保卓越的质量和一致性。箔经过仔细检查,以满足指定的纯度水平,杜绝任何缺陷,如划痕、凹痕和撕裂。铜箔是一种非常通用的材料,提供卓越的导电性、导热性和耐腐蚀性。

应用

铜箔通常用于各种应用,如印刷电路板(PCB)、电磁屏蔽,并作为化学气相沉积的衬底。0.25 毫米厚度的这种箔使其适用于许多应用,提供足够的强度和耐用性,同时保持易于处理和操作。99.98% 的痕量金属确保了铜箔的最高质量,只有最低水平的杂质,如铅、砷和铋。这种纯度水平对于许多工业应用至关重要,特别是在电子工业中,即使少量的杂质也会显著影响最终产品的性能和可靠性。

数量

50 × 50 mm(约 5.5 g)
150 × 150 mm(约 49.5g)

储存分类代码

13 - Non Combustible Solids

WGK

WGK 2

闪点(°F)

Not applicable

闪点(°C)

Not applicable

个人防护装备

Eyeshields, Gloves, type N95 (US)


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Seiko Ishida et al.
Proceedings of the National Academy of Sciences of the United States of America, 110(48), 19507-19512 (2013-11-13)
Copper is an essential trace element, the imbalances of which are associated with various pathological conditions, including cancer, albeit via largely undefined molecular and cellular mechanisms. Here we provide evidence that levels of bioavailable copper modulate tumor growth. Chronic exposure
R Squitti et al.
Neurology, 67(1), 76-82 (2006-07-13)
To assess whether serum copper in Alzheimer disease (AD) correlates with cognitive scores, beta-amyloid, and other CSF markers of neurodegeneration. The authors studied copper, ceruloplasmin, total peroxide, and antioxidants levels (TRAP) in serum; beta-amyloid in plasma; and copper, beta-amyloid, h-tau
Stephen G Kaler et al.
The New England journal of medicine, 358(6), 605-614 (2008-02-08)
Menkes disease is a fatal neurodegenerative disorder of infancy caused by diverse mutations in a copper-transport gene, ATP7A. Early treatment with copper injections may prevent death and illness, but presymptomatic detection is hindered by the inadequate sensitivity and specificity of
Hiroshi Sato et al.
Science (New York, N.Y.), 343(6167), 167-170 (2013-12-18)
Carbon monoxide (CO) produced in many large-scale industrial oxidation processes is difficult to separate from nitrogen (N2), and afterward, CO is further oxidized to carbon dioxide. Here, we report a soft nanoporous crystalline material that selectively adsorbs CO with adaptable
Magnus Andersson et al.
Nature structural & molecular biology, 21(1), 43-48 (2013-12-10)
Heavy metals in cells are typically regulated by PIB-type ATPases. The first structure of the class, a Cu(+)-ATPase from Legionella pneumophila (LpCopA), outlined a copper transport pathway across the membrane, which was inferred to be occluded. Here we show by

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