Merck
All Photos(1)

767476

Sigma-Aldrich

铜

sputtering target, diam. × thickness 2.00 in. × 0.25 in., 99.95% trace metals basis

All Photos(1)
Empirical Formula (Hill Notation):
Cu
CAS Number:
7440-50-8
Molecular Weight:
63.55
EC 号:
231-159-6
MDL编号:
MFCD00010965
PubChem化学物质编号:
329767316
NACRES:
NA.23

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质量水平

100

测定

99.95% trace metals basis

形式

turnings

reaction suitability

core: copper

电阻率

1.673 μΩ-cm, 20°C

直径× 厚度

2.00 in. × 0.25 in.

bp

2567 °C (lit.)

mp

1083.4 °C (lit.)

密度

8.94 g/mL at 25 °C (lit.)

SMILES string

[Cu]

InChI

1S/Cu

InChI key

RYGMFSIKBFXOCR-UHFFFAOYSA-N

Related Categories

应用

Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. The extreme miniaturization of components in the semiconductor and electronics industry requires high purity sputtering targets for thin film deposition.

包装

1 ea in rigid mailer

储存分类代码

13 - Non Combustible Solids

WGK

WGK 2

闪点(F)

Not applicable

闪点(C)

Not applicable

Certificate of Analysis

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Certificate of Origin

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