推荐产品
等級
certified reference material
agency
IRMM®
自燃溫度
860 °F
製造商/商標名
JRC
電阻係數
42.0 μΩ-cm, 20°C
bp
3287 °C (lit.)
mp
1660 °C (lit.)
密度
4.5 g/mL at 25 °C (lit.)
格式
matrix material
SMILES 字串
[Ti]
InChI
1S/Ti
InChI 密鑰
RTAQQCXQSZGOHL-UHFFFAOYSA-N
分析報告
For more information please see:
IRMM531A
IRMM531A
法律資訊
IRMM is a registered trademark of European Commission
儲存類別代碼
11 - Combustible Solids
水污染物質分類(WGK)
nwg
閃點(°F)
Not applicable
閃點(°C)
Not applicable
International journal of computerized dentistry, 16(2), 125-141 (2013-08-13)
This article presents two novel options for lithium-disilicate restorations supported by single-tooth implants. By using a Ti-Base connector, hybrid abutments and hybrid abutment crowns can be fabricated for different implant systems. The latter option in particular is an interesting new
Journal of nanoscience and nanotechnology, 13(8), 5807-5810 (2013-07-26)
In this study, hydroxyapatite (HA) was coated on anodized titanium (Ti) surfaces through radio frequency magnetron sputtering in order to improve biological response of the titanium surface. All the samples were blasted with resorbable blasting media (RBM). RBM-blasted Ti surface
Journal of nanoscience and nanotechnology, 13(7), 5109-5114 (2013-08-02)
In the present study, self-cleaning and mechanical properties of white Portland cement by addition of commercial available TiO2 nanoparticles with the average particle size of 80 nm were investigated. X-ray diffraction (XRD), transmission electron microscopy (TEM) and BET were used
Study of a TiO2 photocatalytic coating for use in plasma catalysis.
Communications in agricultural and applied biological sciences, 78(1), 227-233 (2013-07-24)
Journal of biomedical nanotechnology, 9(6), 1092-1097 (2013-07-19)
Improvements in osteoconduction of implant biomaterials require focusing on the bone-implant interface, which is a complex multifactorial system. Surface topography of implants plays a crucial role at this interface. Nanostructured surfaces have been shown to promote serum protein adsorption and
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