165212
98%
liquid
n20/D 1.471 (lit.)
105-107 °C/2 mmHg (lit.)
1.259 g/mL at 25 °C (lit.)
ClC(=O)CCCCC(Cl)=O
1S/C6H8Cl2O2/c7-5(9)3-1-2-4-6(8)10/h1-4H2
PWAXUOGZOSVGBO-UHFFFAOYSA-N
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Danger
Skin Corr. 1B
8A - Combustible, corrosive hazardous materials
WGK 3
233.6 °F - closed cup
112 °C - closed cup
dust mask type N95 (US), Eyeshields, Gloves
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Atomic layer deposition (ALD) techniques have emerged in the last ten years to meet various needs including semiconductor device miniaturization, conformal deposition on porous structures and coating of nanoparticles. ALD is based on two sequential self-limiting surface reactions.
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