≥99.99% trace metals basis (purity exclusive of Na and K content)
assay
99.98% trace metals basis
assay
99.7% trace metals basis
form
solid
form
-
form
foil
form
foil
density
4.5 g/mL at 25 °C (lit.)
density
4.5 g/mL at 25 °C (lit.)
density
4.5 g/mL at 25 °C (lit.)
density
4.5 g/mL at 25 °C (lit.)
mp
1660 °C (lit.)
mp
1660 °C (lit.)
mp
1660 °C (lit.)
mp
1660 °C (lit.)
bp
3287 °C (lit.)
bp
3287 °C (lit.)
bp
3287 °C (lit.)
bp
3287 °C (lit.)
autoignition temp.
860 °F
autoignition temp.
860 °F
autoignition temp.
860 °F
autoignition temp.
860 °F
Application
Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. The extreme miniaturization of components in the semiconductor and electronics industry requires high purity sputtering targets for thin film deposition.
Our team of scientists has experience in all areas of research including Life Science, Material Science, Chemical Synthesis, Chromatography, Analytical and many others.