931071

Copper(II) sulfate

anhydrous, free-flowing, Redi-Dri^™, ≥99.99% trace metals basis

• Synonym(s): Copper sulphate, Cupric sulfate
• Linear Formula: CuSO₄
• CAS Number: 7758-98-7
• Molecular Weight: 159.61
• MDL number: MFCD00010981

Properties

• grade: anhydrous
• Quality Level: 200
• vapor pressure: 7.3 mmHg ( 25 °C)
• product line: Redi-Dri^™
• Assay: ≥99.99% trace metals basis
• form: powder
• quality: free-flowing
• impurities: ≤100 ppm (trace metals analysis)
• mp: 200 °C (dec.) (lit.)
• solubility: H₂O: soluble ((lit.)); acetone: insoluble ((lit.)); ethanol: insoluble ((lit.))
• density: 3.603 g/mL at 25 °C (lit.)
• SMILES string: [Cu++].[O-]S([O-])(=O)=O
• InChI: 1S/Cu.H2O4S/c;1-5(2,3)4/h;(H2,1,2,3,4)/q+2;/p-2
• InChI key: ARUVKPQLZAKDPS-UHFFFAOYSA-L

Description

General description

The anhydrous form of Copper(II) sulfate is a white to light grey salt. It occurs naturally as the mineral hydrocyanite. The salt is soluble in water and insoluble in ethanol and acetone. The anhydrous form decomposes to its oxide at temperatures above 600 °C.
In industrial preparation of CuSO₄, a hot mixture of dilute sulfuric acid and scrap copper is exposed to air flow.
The resulting salt is purified and dehydrated to yield the anhydrous form.
Copper sulfate is corrosive and behaves as an acidic salt. Aqueous solutions of Copper(II) sulfate corrode steel and iron.

Application

A major application of Copper(II) sulfate is as a source of copper for electroplating copper films. Electroplating copper from copper sulfate is used extensively in semiconductor packaging, for example in fabricating copper interconnects in silicon integrated circuits. It is used in the dual damascene technique, plating through-silicon vias, and constructing copper pillars. Copper sulfate is also used to prepare copper foil, by electrodepositing copper onto a rolling drum and simultaneously coiling the produced foil on a second roller.
Researchers have also used Copper(II) sulfate as a copper source to prepare copper nanoparticles and copper sulfide nanoparticles. CuSO₄ can also be used to synthesize copper complexes such as copper hexaiminotriphenylene metal organic frameworks and protein-copper nanoflowers.

Features and Benefits

• Longer shelf-life as a free-flowing powder without addition of anti-caking agents
• Slower absorption of environmental moisture
• Faster dissolution compared to clumped materials
• No need to chip, chisel, or grind clumped salts
• While the Redi-Dri^™ packaging system does offer desiccating properties, opening and closing of the Redi-Dri^™ bottle is still intended to occur under controlled atmosphere to maintain the highest quality of your MilliporeSigma product.

Packaging

Redi Dri^™ is an innovative packaging system that prevents absorption of environmental moisture by anhydrous & hydroscopic salts during transport and chemical storage without addition of anti-caking agents, preserving the compounds′ quality assured, free-flowing nature. Redi-Dri^™ also provides a conveniently resealable storage container as a simpler and safer-to-use alternative to one-time-use packaging such as ampules.

While the Redi-Dri^™ packaging system does offer desiccating properties, opening and closing of the Redi-Dri^™ bottle is still intended to occur under controlled atmosphere to maintain the highest quality of your MilliporeSigma product.

Legal Information

Redi-Dri is a trademark of Sigma-Aldrich Co. LLC

Safety Information

• Pictograms: GHS05,GHS07,GHS09
• Signal Word: Danger
• Hazard Statements: H302 - H318 - H410
• Precautionary Statements: P264 - P273 - P280 - P301 + P312 - P305 + P351 + P338 - P391
• Hazard Classifications: Acute Tox. 4 Oral - Aquatic Acute 1 - Aquatic Chronic 1 - Eye Dam. 1
• Storage Class Code: 13 - Non Combustible Solids
• WGK: WGK 3
• Flash Point(F): Not applicable
• Flash Point(C): Not applicable