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Z561665

Expanded tabletop plasma cleaner

AC/DC input 230 V AC, Schuko plug

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Select a Size

NACRES:
NB.79

feature

CE compliant

H × W × D

11 in. × 18 in. × 9 in.
11 in. × 18 in. × 9 in.

chamber diam. × L

6 in. × 6 in.
6 in. × 6.5 in.

weight

37 lb

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This Item
Z561657Z561673Z561703
Expanded tabletop plasma cleaner AC/DC input 230 V AC, Schuko plug

Z561665

Expanded tabletop plasma cleaner

Expanded tabletop plasma cleaner AC/DC input 115 V AC

Z561657

Expanded tabletop plasma cleaner

Basic tabletop plasma cleaner AC/DC input 110 V AC

Z561673

Basic tabletop plasma cleaner

H × W × D

11 in. × 18 in. × 9 in.

H × W × D

11 in. × 18 in. × 9 in.

H × W × D

8 in. × 10 in. × 8 in. , 8.5 in. × 10 in. × 8 in.

H × W × D

8.5 in. × 10 in. × 8 in.

chamber diam. × L

6 in. × 6 in.

chamber diam. × L

6 in. × 6 in. , 6 nL × 6.5 in.

chamber diam. × L

3 in. × 7 in.

chamber diam. × L

-

weight

37 lb

weight

37 lb

weight

-

weight

12 lb

General description

A larger, tabletop plasma cleaner with four times the capacity of the basic plasma cleaner, suitable for nanoscale surface cleaning and activation of small samples. Plasma treatment may be applied to a wide variety of materials, including glass, semiconductors, polymers, and metals. Useful applications include surface cleaning of substrates for enhanced adhesion, plasma activation for microfluidic device fabrication, and surface chemistry modification of biomaterials and polymers.

  • Adjustable RF power (Low, Medium, High power settings); Maximum 30W
  • 6 in. diameter x 6.5 in length Pyrex chamber (optional quartz chamber)
  • Hinged door with viewing window
  • Active fan cooling
  • 1/8" NPT metering valve to qualitatively control gas flow and chamber pressure
  • 1/8" NPT 3-way valve to quickly switch from introducing gas, venting, and isolating the chamber
  • Requires a separate vacuum pump to run the plasma process
A compact, tabletop plasma cleaner used for nanoscale surface cleaning, surface activation, and surface chemistry alteration. Plasma treatment may be applied to a wide variety of materials, including glass, semiconductors, polymers, and metals. Useful applications include surface cleaning of substrates for enhanced adhesion, pre-bond preparation for microfluidic device fabrication, and surface modification of biomaterials and polymers.
  • Adjustable RF power (Low, Medium, High power settings): Maximum 30 W
  • 6 in. diam. x 6.5 in. L Pyrex® chamber (optional quartz chamber)
  • Valve assembly to control gas flow
  • Hinged door with viewing window
  • Fan cooling
  • Requires a separate vacuum pump to run the plasma process
  • Optional PlasmaFlo gas flow mixer allows fine control of up to 2 process gases, gas mixing, and monitoring of vacuum pressure

Legal Information

PYREX is a registered trademark of Corning, Inc.

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