231-130-8
- EC No.:
- 231-130-8
CytoSoft®, Discovery Kit
- EC No.:
- 231-130-8
5190
Multiple Elastic Moduli, (0.2, 0.5, 2, 8, 16, 32, 64 kPa)
647543
wafer (single side polished), <111>, N-type, contains no dopant, diam. × thickness 3 in. × 0.5 mm
215619
powder, −325 mesh, 99% trace metals basis
646687
wafer (single side polished), <100>, N-type, contains no dopant, diam. × thickness 2 in. × 0.5 mm
647101
wafer (single side polished), <111>, N-type, contains no dopant, diam. × thickness 2 in. × 0.5 mm
633097
nanopowder, <100 nm particle size (TEM), ≥98% trace metals basis
647764
wafer (single side polished), <100>, P-type, contains boron as dopant, diam. × thickness 3 in. × 0.5 mm
343250
pieces, 99.95% trace metals basis
647535
wafer (single side polished), <100>, N-type, contains no dopant, diam. × thickness 3 in. × 0.5 mm