1.02700
Copper
foil about 0.1 mm thickness for analysis EMSURE®
Synonym(s):
Copper
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R 2,258.90
R 2,258.90
List PriceR 2,305.00About This Item
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SMILES string
[Cu]
InChI
1S/Cu
InChI key
RYGMFSIKBFXOCR-UHFFFAOYSA-N
product line
EMSURE®
assay
≥99.7% (iodometric)
form
solid
impurities
≤0.02% Substances insoluble in nitric acid
bp
2580 °C/1013 hPa
mp
1083 °C
density
8.96 g/cm3
bulk density
1000 kg/m3
cation traces
Ag: ≤0.002%, As: ≤0.0002%, Fe: ≤0.005%, Mn: ≤0.005%, Pb: ≤0.05%, Sb: ≤0.005%, Sn: ≤0.005%
storage temp.
2-30°C
Quality Level
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1 of 4
This Item | GF60103000 | GF27828669 | GF98489952 |
|---|---|---|---|
| form solid | form foil | form foil | form foil |
| assay ≥99.7% (iodometric) | assay 99.9% | assay ≥99.99% | assay ≥99.99% |
| bp 2580 °C/1013 hPa | bp 2567 °C (lit.) | bp 2567 °C (lit.) | bp 2567 °C (lit.) |
| density 8.96 g/cm3 | density 8.94 g/mL at 25 °C (lit.) | density 8.94 g/mL at 25 °C (lit.) | density 8.94 g/mL at 25 °C (lit.) |
| mp 1083 °C | mp 1083.4 °C (lit.) | mp 1083.4 °C (lit.) | mp 1083.4 °C (lit.) |
| product line EMSURE® | product line - | product line - | product line - |
Application
- Electron-electron scattering limits thermal conductivity of metals under extremely high electron temperatures: The study discusses how copper′s thermal properties are influenced under extreme conditions, applicable in high-performance electronics (Karna and Giri, 2024).
- Lateral Flow Assay Biotesting by Utilizing Plasmonic Nanoparticles Made of Inexpensive Metals: Demonstrates copper′s potential as a cost-effective alternative to gold in diagnostic assays, broadening access to healthcare technologies (Bahamondes Lorca et al., 2024).
Analysis Note
Substances insoluble in nitric acid: ≤ 0.02 %
Ag (Silver): ≤ 0.002 %
As (Arsenic): ≤ 0.0002 %
Fe (Iron): ≤ 0.005 %
Mn (Manganese): ≤ 0.005 %
Pb (Lead): ≤ 0.05 %
Sb (Antimony): ≤ 0.005 %
Sn (Tin): ≤ 0.005 %
Legal Information
Storage Class
13 - Non Combustible Solids
wgk
WGK 2
flash_point_f
Not applicable
flash_point_c
Not applicable
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