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Nihon Hotetsu Shika Gakkai zasshi

[A light-cured acrylic adhesive for fixing resin retention devices to the wax pattern].


PMID 2134790

Abstract

A light-cured acrylic adhesive for fixing resin retention devices to the wax pattern was prepared. The adhesive consisted of trimethylolpropane triacrylate, 2-ethylhexyl acrylate, benzoin methyl ether, p dimethylaminobenzaldehyde and p-methoxyphenol. The adhesive could be cured within 20 sec not only by an UV photo curing unit but by a visible-light source with a xenon lamp. The adhesive and retention beads burned out after about an hour in the electric furnace at 400 c. The metal specimens with retention devices were cast in Ag-Pd-Cu-Au alloy with the use of two types of retention beads adhesive. The light-cured adhesive was superior to the conventional one in handling and some other properties. This adhesive may be used to fabricate composite veneered prostheses with minimum errors in laboratory procedure.