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643262 Sigma-Aldrich

Gold coated silicon wafer

99.999% (Au), layer thickness 1000 Å, 99.99% (Ti)

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Properties

Related Categories Electronic Materials, Gold Coated Substrates, Gold Surfaces and Sources, Materials Science, Micro/NanoElectronics,
InChI Key   PCHJSUWPFVWCPO-UHFFFAOYSA-N
assay   99.99% (Ti)
  99.999% (Au)
diam. × thickness   4 in. × 500 μm
layer thickness   1000 Å
matrix attachment   Titanium, as adhesion layer used to bind the gold to the silicon wafer.

Description

General description

The product is highly crystalline, with <111> orientation gold and <100> orientation silicon wafer is used. Titanium is used as an adhesion layer to bind gold to the silicon wafer.

Application

Gold coated silicon wafers may be used in soft lithography for micro and nanoscale patterning.

Packaging

1 ea in padded box

Packaging 1 set in single wafer shipper

Safety & Documentation

Safety Information

RIDADR 
NONH for all modes of transport
WGK Germany 
3

Documents

Certificate of Analysis

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Protocols & Articles

Articles

Displaceable Monolayers and Microdisplacement Printing: 1-Adamantanethiol Assembly and Applications

Self-assembly techniques at the supramolecular 1–100 nm scale have been extensively studied for applications ranging from biocompatible systems to microelectronics.1, 2 As the dimensions of patterned...
Thomas J. Mullen, J. Nathan Hohman, Dr. Arrelaine A. Dameron, Jennifer R. Hampton, Susan D. Gillmor, Prof. Paul S. Weiss
Material Matters 2006, 1.2, 8.
Keywords: Adsorption, Applications, Degradations, Deposition, Diffusion, Material Matters, Microelectronics, Microscopy, Nanotechnology, Semiconductor, Separation, Support, Type

Synthesis of Melting Gels Using Mono-Substituted and Di-Substituted Alkoxysiloxanes

Hybrid organic-inorganic sol-gel materials containing silica were first called “ORMOSILs” in 1984.1 Since then, the number of hybrid organicinorganic combinations has increased rapidly.2 Hybrid mater...
Lisa C. Klein and Andrei Jitianu
Material Matters, Volume 7, Number 2, 8–14
Keywords: Absorption, Adhesion, Calorimetry, Combustion, Condensations, Deposition, Exothermic, Filtration, Materials Science, Melting, Oxidations, Polymerization reactions, Purification, Semiconductor, Sol-gel, Solar cells, Solvents, Spin coating, Substitutions, Thermal analysis

Peer-Reviewed Papers
15

References

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