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761036 Sigma-Aldrich

SYLGARD® 184

10 g clip-pack

Synonym: Curing agent, Polydimethylsiloxane, Silicone, Vinyl-terminated PDMS

  •  NACRES NA.23

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Description

General description

SYLGARD®184 is a silicone based elastomeric kit that is a two component system with a polymeric base and a curing agent which cross-links with the polymeric matrix. The resulting composite formed is a polydimethylsiloxane (PDMS) with tensile strength (UTS) of ~5.2 MPa and shore hardness of ~44 at room temperature. The UTS, hardness and the young′s modulus (E) increase at a higher curing temperature.

Application

SYLGARD®184 based PDMS can be used in soft-lithography for a variety of applications such as microfluidics, microelectromechanical systems (MEMS) and other flexible electronic devices. It also forms hydrophobic PDMS films which can be used as moisture membrane in photovoltaic cells.

Preweighed monomer and curing agent in convenient blister packs.
SYLGARD 184 Silicone Elastomer Kit is comprised of Base/Curing Agent to be mixed in a 10 (base) :1 (curing agent) ratio by weight for manual mixing.

Legal Information

Sylgard is a registered trademark of The Dow Chemical Company or an affiliated company of Dow

Safety & Documentation

Safety Information

Symbol 
GHS07  GHS07
Signal word 
Warning
Hazard statements 
Precautionary statements 
RIDADR 
NONH for all modes of transport
Flash Point(F) 
249.8 °F
Flash Point(C) 
121 °C

Documents

Certificate of Analysis (COA)

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Protocols & Articles

Articles

Kit for PDMS Surface Modification

In collaboration with Clemson University and the Pennsylvania State University, we have developed a Surface Modification Kit, which allows for durable hydrophilization of various polydimethylsiloxane...
Keywords: Solvents

Organic Optoelectronics on Shape Memory Polymers

Center for Organic Photonics and Electronics (COPE), School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, USA *E-mail: bernard.kippelen@ece.gatech.e...
Canek Fuentes-Hernandez, Bernard Kippelen*
Material Matters, 2017, 12.3
Keywords: AGE, Adhesion, Atomic layer deposition, Biological processes, Catalysis, Ceramics, Deposition, Electronics, Environmental, Nanomaterials, Nanotubes, Oxidations, Photovoltaics, Polymerization reactions, Reductions, Semiconductor, Separation

Peer-Reviewed Papers
15

References

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