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901823 Sigma-Aldrich

Nickel electroplating solution

Synonym: Ni electroplating solution, Ni plating solution

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Properties

Related Categories Electronic Chemicals, Electroplating Solutions, Materials Science, Micro/NanoElectronics
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  30 g/L±0.5 g/L (H3BO3)
  4.25 g/L±0.25 g/L (Stress reducer)
  9.51 g/L±1 g/L (NiBr2 ·xH2O)

Description

Features and Benefits

• Deposits have low internal stress and are very ductile.
• Surfaces are uniform and smooth with well-controlled thickness and excellent uniformity.
• As plated Ni films have small grains in the range of 10 - 50 nm. Grain size orientations are (111) and (200) for FCC (face centred cubic).
• Qualified bath metrology for replenishment and a long shelf life.

Electroplated Ni film (5-10 μm thickness) properties:
• Density: 8.1 g/cm3
• Young′s modulus: 210 GPa
• Internal stress 33 ± 13 MPa
• Tensile strength: 585 ± 40 MPa
• Grain size: 10-50 nm

General description

Nickel electroplating solution is designed for the fabrication of low stress, smooth and pinhole-free nickel films.

Safety & Documentation

Safety Information

RIDADR 
UN 3082 9 / PGIII

Documents

Certificate of Analysis

Protocols & Articles
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