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Product Name
Copper(I) acetate, 97%
Quality Level
InChI key
RFKZUAOAYVHBOY-UHFFFAOYSA-M
InChI
1S/C2H4O2.Cu/c1-2(3)4;/h1H3,(H,3,4);/q;+1/p-1
SMILES string
CC(=O)O[Cu]
assay
97%
form
powder and chunks
reaction suitability
core: copper
reagent type: catalyst
mp
250 °C (dec.) (lit.)
1 of 4
This Item | 399973 | 337323 | 215554 |
|---|---|---|---|
| form powder and chunks | form crystals and lumps, solid | form powder or chunks, solid | form powder and chunks |
| assay 97% | assay 99.99% trace metals basis | assay - | assay 99.999% trace metals basis |
| mp 250 °C (dec.) (lit.) | mp 298 °C (dec.) (lit.) | mp 252 °C (dec.) (lit.) | mp 605 °C (lit.) |
| reaction suitability core: copper | reaction suitability core: cobalt | reaction suitability core: copper, reagent type: catalyst | reaction suitability - |
| Quality Level 200 | Quality Level 200 | Quality Level 100 | Quality Level 200 |
Application
- A copper source in synthesizing CuS@C nanocomposites for sodium-ion battery anodes, delivering 485 mAh/g capacity after 200 cycles.[1]
- A precursor to synthesize copper oxide thin films through deposition techniques like atomic layer deposition (ALD) and pulsed spray pyrolysis, enabling p-type semiconductor layers for optoelectronic applications.[2]
- A electrocatalyst precursor for CO2 reduction to ethanol. [3]
- A Precursor for superhydrophobic coatings via electrochemical deposition.[4]
General description
Storage Class
11 - Combustible Solids
wgk
WGK 3
flash_point_f
Not applicable
flash_point_c
Not applicable
ppe
dust mask type N95 (US), Eyeshields, Gloves
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Articles
Copper metal deposition processes are an essential tool for depositing interconnects used in microelectronic applications, giving group 11 (coinage metals: Copper, Silver, and Gold) an important place in atomic layer deposition (ALD) process development.
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