Direkt zum Inhalt
Merck

The multiple antibiotic resistance regulator MarR is a copper sensor in Escherichia coli.

Nature chemical biology (2013-11-05)
Ziyang Hao, Hubing Lou, Rongfeng Zhu, Jiuhe Zhu, Dianmu Zhang, Boxuan Simen Zhao, Shizhe Zeng, Xing Chen, Jefferson Chan, Chuan He, Peng R Chen
ZUSAMMENFASSUNG

The widely conserved multiple antibiotic resistance regulator (MarR) family of transcription factors modulates bacterial detoxification in response to diverse antibiotics, toxic chemicals or both. The natural inducer for Escherichia coli MarR, the prototypical transcription repressor within this family, remains unknown. Here we show that copper signaling potentiates MarR derepression in E. coli. Copper(II) oxidizes a cysteine residue (Cys80) on MarR to generate disulfide bonds between two MarR dimers, thereby inducing tetramer formation and the dissociation of MarR from its cognate promoter DNA. We further discovered that salicylate, a putative MarR inducer, and the clinically important bactericidal antibiotics norfloxacin and ampicillin all stimulate intracellular copper elevation, most likely through oxidative impairment of copper-dependent envelope proteins, including NADH dehydrogenase-2. This membrane-associated copper oxidation and liberation process derepresses MarR, causing increased bacterial antibiotic resistance. Our study reveals that this bacterial transcription regulator senses copper(II) as a natural signal to cope with stress caused by antibiotics or the environment.

MATERIALIEN
Produktnummer
Marke
Produktbeschreibung

Sigma-Aldrich
Kupfer, powder, <425 μm, 99.5% trace metals basis
Sigma-Aldrich
Kupfer, foil, thickness 0.25 mm, 99.98% trace metals basis
Sigma-Aldrich
Kupfer, wire, diam. 1.0 mm, ≥99.9%
Sigma-Aldrich
Kupfer, nanopowder, 40-60 nm particle size (SAXS), ≥99.5% trace metals basis
Sigma-Aldrich
Kupfer, powder (dendritic), <45 μm, 99.7% trace metals basis
Sigma-Aldrich
Kupfer, foil, thickness 0.025 mm, 99.98% trace metals basis
Sigma-Aldrich
Kupfer, turnings, purum p.a., ≥99.0%
Sigma-Aldrich
Kupfer, nanopowder, 60-80 nm particle size (APS), ≥99.5% trace metals basis
Sigma-Aldrich
Kupfer, ACS reagent, granular, 10-40 mesh, ≥99.90%
Sigma-Aldrich
Kupfer, beads, 2-8 mm, 99.9995% trace metals basis
Sigma-Aldrich
Kupfer, foil, ≥99.8% (complexometric)
Sigma-Aldrich
Kupfer, foil, thickness 1.0 mm, 99.999% trace metals basis
Sigma-Aldrich
Kupfer, foil, thickness 0.5 mm, 99.98% trace metals basis
Sigma-Aldrich
Kupfer, wire, diam. 0.25 mm, 99.999% trace metals basis
Sigma-Aldrich
Kupfer, shot, −3-+14 mesh, 99%
Sigma-Aldrich
Kupfer, beads, 2-8 mm, ≥99.99% trace metals basis
Sigma-Aldrich
Kupfer, wire, diam. 2.0 mm, 99.999% trace metals basis
Sigma-Aldrich
Kupfer, wire, diam. 0.64 mm, 99.995% trace metals basis
Stranggusskupfer (O), BCR®, certified reference material, rod
Kupfer, IRMM®, certified reference material, 0.5 mm wire
Kupfer, IRMM®, certified reference material, 0.1 mm foil
Kupfer (O), BCR®, certified reference material, rod
Kupfer (S, P), BCR®, certified reference material, chips