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  • Preparation, characterization and application of thiosemicarbazide grafted multiwalled carbon nanotubes for solid-phase extraction of Cd(II), Cu(II) and Pb(II) in environmental samples.

Preparation, characterization and application of thiosemicarbazide grafted multiwalled carbon nanotubes for solid-phase extraction of Cd(II), Cu(II) and Pb(II) in environmental samples.

Journal of environmental sciences (China) (2014-02-21)
Jie Zhang
ZUSAMMENFASSUNG

Thiosemicarbazide-grafted multi-walled carbon nanotubes were prepared and employed to investigate the pre-concentration of Cd(II), Cu(II) and Pb(II) from aqueous solution prior to their determination by ICP-OES. The resulting material was characterized by FT-IR, TGA and SEM. Various factors influencing the separation and pre-concentration were investigated. The enrichment factor typically is 60. Under optimized experimental conditions, the maximum adsorption capacities of Cd(II), Cu(II) and Pb(II) were found to be 1.98, 10.94, 3.69 mg/g, and the relative standard deviations are < 3.5% (n = 6). The new adsorbent shows superior reusability and stability. The procedure was successfully applied to the determination of trace quantities of Cd(II), Cu(II) and Pb(II) in water samples.

MATERIALIEN
Produktnummer
Marke
Produktbeschreibung

Sigma-Aldrich
Thiosemicarbazid, 99%
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Kupfer, powder, <425 μm, 99.5% trace metals basis
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Kupfer, foil, thickness 0.25 mm, 99.98% trace metals basis
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Kupfer, powder, 99.99% trace metals basis
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Blei, powder, −100 mesh, 99.95% trace metals basis
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Kupfer, powder, <75 μm, 99%
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Kupfer, wire, diam. 1.0 mm, ≥99.9%
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Cadmium, granular, 30-80 mesh, ≥99%
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Cadmium, powder, −100 mesh, 99.5% trace metals basis
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Kupfer, nanopowder, 40-60 nm particle size (SAXS), ≥99.5% trace metals basis
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Kupfer, powder (spheroidal), 10-25 μm, 98%
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Kupfer, powder (dendritic), <45 μm, 99.7% trace metals basis
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Kupfer, foil, thickness 0.025 mm, 99.98% trace metals basis
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Kupfer, turnings, purum p.a., ≥99.0%
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Kupfer, nanopowder, 60-80 nm particle size (APS), ≥99.5% trace metals basis
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Cadmium, granular, ≥99%, 5-20 mesh
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Kupfer, ACS reagent, granular, 10-40 mesh, ≥99.90%
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Kupfer, beads, 2-8 mm, 99.9995% trace metals basis
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Kupfer, foil, ≥99.8% (complexometric)
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Kupfer, foil, thickness 1.0 mm, 99.999% trace metals basis
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Blei, shot, <2 mm, 99.9% trace metals basis
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Kupfer, foil, thickness 0.5 mm, 99.98% trace metals basis
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Kupfer, wire, diam. 0.25 mm, 99.999% trace metals basis
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Kupfer, shot, −3-+14 mesh, 99%
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Thiosemicarbazid, puriss. p.a., 98%
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Blei, powder, −325 mesh, ≥99% trace metals basis
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Kupfer, beads, 2-8 mm, ≥99.99% trace metals basis
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Blei, shot, 1-3 mm, 99.995% trace metals basis
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Kupfer, wire, diam. 2.0 mm, 99.999% trace metals basis
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Kupfer, wire, diam. 0.64 mm, 99.995% trace metals basis