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GRFETS10

Graphene FET chip

S10

Synonym(e):

Graphene FET, Graphene FET sensor, Graphene FET with 30 Hall-bar devices and 6 2-probe configurations with varied channel geometry

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NACRES:
NA.23
UNSPSC Code:
43211915

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description

Dirac point:< 50 V , Gate Oxide material: SiO2, Gate Oxide thickness: 90 nm, Graphene field-effect mobility: >1000 cm2/V·s, Maximum gate-source voltage: ± 50 V
Maximum temperature rating: 150 °C
Maximum drain-source current density: 107 A/cm2, Metallization: Chromium 2 nm/Gold 50 nm, Monolayer CVD grown Graphene based field effect transistors (FET) S10, Residual charge carrier density: <2 x 1012 cm-2, Resistivity of substrate: 1-10 Ω·cm, Yield >75%

General description

Graphene FET chip (GFET-S10 chip) is a graphene based field effect transistor chip with a symmetric transconductance of 8 μS and an operational current density of 105 A/cm2. The fabricated device has a monolayered graphene which is coated by chemical vapor deposition (CVD) on silicon substrate. It also has similar gate insulators in the source and drain.
Device configuration:

This Graphene FET chip provides 36 graphene devices distributed in a grid pattern on the chip. 30 devices have Hall-bar geometry and 6 have 2-probe geometry.
The Hall-bar devices can be used for Hall measurements as well as 4-probe and 2-probe measurements. There are graphene channels with varied dimensions to allow systematic investigation of device properties.

Application

  • Graphene device research
  • FET based sensor research for active materials deposited on graphene
  • Chemical sensors
  • Biosensors
  • Bioelectronics
  • Magnetic sensors
  • Photodetectors
GFET-S10 chip can be used as a biosensor and a chemical sensor for biological applications.

Features and Benefits

Device Features:

  • State-of-art graphene FETs utilizing consistent high-quality CVD grown monolayer graphene
  • Devices are not encapsulated and can be functionalized by additives
  • Perfect platform for sensor research and development
  • 36 individual graphene FETs per chip
  • Mobilities typically > 1000 cm2/V·s

Disclaimer

Basic handling instructions:The monolayer CVD graphene used in this FET device is highly prone to damage by external factors.
To maintain the quality of the devices, we recommend taking the following precautions:
  • Be careful when handling the graphene FET chip.
  • Tweezers should not contact the device area directly.

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Gate Oxide material: SiO2, Graphene field-effect mobility: >1000 cm2/V·s, Residual charge carrier density: <2 x 1012 cm-2, Yield >75%, Metallization: Chromium 2 nm/Gold 50 nm, Resistivity of substrate: 1-10 Ω·cm, Maximum gate-source voltage: ± 50 V
Maximum temperature rating: 150 °C
Maximum drain-source current density: 107 A/cm2, Dirac point:< 50 V , Gate Oxide thickness: 90 nm

description

Graphene field-effect mobility: >1000 cm2/V·s, Dirac point: < 50 V
Yield >75%, Gate oxide materials: 90 nm SiO2, Resistivity of substrate: 1-10 Ω·cm
Metallization: Chromium/Gold-Palladium 2/50 nm, Encapsulation: 50 nm Al2O3 + 100 nm Si3N4, Chip thickness: 675 μm, Absolute Maximum Ratings
Maximum gate-source voltage: ± 50 V
Maximum temperature rating: 150 °C
Maximum drain-source current density: 107 A/cm2, Monolayer CVD grown Graphene based 2-probe field effect transistors (FET)., Chip dimensions: 10 mm x 10 mm, Number of devices per chip: 12

description

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description

FET Electron Mobility on Al2O3: 2;000 cm2/V·s, Grain size: Up to 10 μm, Coverage: >95%, Transparency: >97%, FET Electron Mobility on SiO2/Si (expected): 4; 000 cm2/V·s, Number of graphene layers: 1


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Lagerklasse

11 - Combustible Solids

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