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Informacje o tej pozycji
material
copper
description
Regular grids with center mark and solid border
packaging
vial of 100 grids
diam.
3.05 mm
grid size
200 mesh × 125 μm pitch
hole W
97 μm
open area size
55%
Application
1 of 1
Ta pozycja | |||
|---|---|---|---|
| description grid size 200 mesh × 125 μm pitch, copper | description grid size 200 mesh × 125 μm pitch, gold | description grid size 200 mesh × 125 μm pitch, nickel | description grid size 150 mesh × 165 μm pitch, copper |
| packaging vial of 100 grids | packaging vial of 100 grids | packaging vial of 100 grids | packaging vial of 100 grids |
| material copper | material gold | material nickel | material copper |
| grid size 200 mesh × 125 μm pitch | grid size 200 mesh × 125 μm pitch | grid size 200 mesh × 125 μm pitch | grid size 150 mesh × 165 μm pitch |
| diam. 3.05 mm | diam. 3.05 mm | diam. 3.05 mm | diam. 3.05 mm |
| open area size 55% | open area size 55% | open area size 55% | open area size 64% |
| hole W 97 μm | hole W 97 μm | hole W 97 μm | hole W 132 μm |
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