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Electrodeposition in capillaries: bottom-up micro- and nanopatterning of functional materials on conductive substrates.

ACS applied materials & interfaces (2011-08-16)
Antony George, A Wouter Maijenburg, Michiel G Maas, Dave H A Blank, Johan E Ten Elshof
ABSTRACT

A cost-effective and versatile methodology for bottom-up patterned growth of inorganic and metallic materials on the micro- and nanoscale is presented. Pulsed electrodeposition was employed to deposit arbitrary patterns of Ni, ZnO, and FeO(OH) of high quality, with lateral feature sizes down to 200-290 nm. The pattern was defined by an oxygen plasma-treated patterned PDMS mold in conformal contact with a conducting substrate and immersed in an electrolyte solution, so that the solid phases were deposited from the solution in the channels of the patterned mold. It is important that the distance between the entrance of the channels, and the location where deposition is needed, is kept limited. The as-formed patterns were characterized by high resolution scanning electron microscope, energy-dispersive X-ray analysis, atomic force microscopy, and X-ray diffraction.

MATERIALS
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Sigma-Aldrich
Iron(II) oxide, −10 mesh, ≥99.6% trace metals basis

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