This product has not been tested for use in this application. Based on the trace metals purity and form of the copper beads, suitability for e-beam deposition is expected.
326488
Copper
beads, 2-8 mm, ≥99.99% trace metals basis
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| Size/SKU | Availability | Price |
|---|---|---|
50 g | Available to ship TODAY | $261.00 |
250 g | Available to ship TODAY | $767.00 |
About This Item
Linear Formula:
Cu
CAS Number:
Molecular Weight:
63.55
NACRES:
NA.23
PubChem Substance ID:
UNSPSC Code:
12141711
EC Number:
231-159-6
MDL number:
eCl@ss:
38150101
$261.00
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Quality Segment
assay
≥99.99% trace metals basis
form
beads
composition
Cu
reaction suitability
core: copper
resistivity
1.673 μΩ-cm, 20°C
particle size
2-8 mm
bp
2567 °C (lit.)
mp
1083.4 °C (lit.)
density
8.94 g/mL at 25 °C (lit.)
application(s)
electroplating
metallization
SMILES string
[Cu]
InChI
1S/Cu
InChI key
RYGMFSIKBFXOCR-UHFFFAOYSA-N
1 of 1
This Item | |||
|---|---|---|---|
| description beads, 2-8 mm, ≥99.99% trace metals basis | description tube, 100mm, outside diameter 3.0mm, inside diameter 1.2mm, wall thickness 0.9mm, as drawn, 99.9% | description foil, thickness 0.0015 mm, purity 99.97%, size 25 × 25 mm | description foil, thickness 0.05 mm, length 50 m, coil width 12 mm |
| assay ≥99.99% trace metals basis | assay 99.9% | assay 99.97% | assay - |
| form beads | form tubes | form foil | form foil |
| density 8.94 g/mL at 25 °C (lit.) | density 8.94 g/mL at 25 °C (lit.) | density 8.94 g/mL at 25 °C (lit.) | density 8.94 g/mL at 25 °C (lit.) |
| mp 1083.4 °C (lit.) | mp 1083.4 °C (lit.) | mp 1083.4 °C (lit.) | mp 1083.4 °C (lit.) |
| bp 2567 °C (lit.) | bp 2567 °C (lit.) | bp 2567 °C (lit.) | bp 2567 °C (lit.) |
| resistivity 1.673 μΩ-cm, 20°C | resistivity 1.673 μΩ-cm, 20°C | resistivity 1.673 μΩ-cm, 20°C | resistivity 1.673 μΩ-cm, 20°C |
Storage Class
13 - Non Combustible Solids
WGK
WGK 2
Flash Point (°F)
Not applicable
Flash Point (°C)
Not applicable
PPE (personal protective equipment)
Eyeshields, Gloves, type N95 (US)
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Is this Copper (Cu) product suitable for use as a source material in an e-beam evaporator for thin-film deposition?
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